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Email: sales@ri-tech.co.za

COM Express Type-6

TQMxE39C2: COMe Type6 with Intel® Atom™ E3900 and SO-DIMM memory

  • Intel® Atom™ x5/x7 E3900 series processors
  • Dual/Quad core with up to 2.5 GHz
  • Up to 8 GB DDR3L (2 SO-DIMMs), non-ECC
  • Up to 64 GB eMMC Flash, soldered
  • Gigabit Ethernet, 8x USB (3.0 / 2.0) and up to 4 PCIe lanes
  • Triple display support (up to 4K UHD) and eDP/LVDS
  • Watchdog und thermal management
Rugged Interconnect Technologies TM - TQMxE39C2

TQMxE39C1: COMe Type6 with Intel® Atom™ E3900 and ECC memory

  • Intel® Atom™ x5/x7 E3900 series (“Apollo Lake-I“)
  • Dual/Quad core computing power with up to 2.5 GHz
  • 4/8 GB DDR3L (dual channel), soldered, ECC
  • Up to 64 GB eMMC Flash, soldered
  • Gigabit Ethernet
  • Gigabit Ethernet, 8x USB (3.0 / 2.0) and up to 4 PCIe lanes
  • Triple display support (up to 4K UHD) and eDP/LVDS
  • Watchdog and thermal management
  • Conformal coating (on request)
Rugged Interconnect Technologies TM - TQMxE39C1

TQMx60EB: COMe Type-6 with Intel® Xeon®  E3-15xx v5

  •  Intel® Xeon®  E3-15xx v5 with Quad-Core 3.7 GHz / 8 MB cache
  • Impressive graphics performance (Intel® Iris™ Pro)
  • Up to 32 GB Dual-Channel DDR4 (2 SO-DIMMs), ECC
  • Up to 24 PCIe lanes (Gen. 3) (incl. PCIe x16 PEG port)
  • TQMx86 board controller with flexiCFG options
  • Mobile Intel® 100 series chipset (CM238)
  • Watchdog and thermal management
Rugged Interconnect Technologies TM - TQMx60EB

TQMx70EB: COMe Type-6 with Intel® Xeon®  E3-15xx v6

  • Intel® Xeon®  E3-15xx v6 with Quad-Core 3.7 GHz / 8 MB cache
  • Impressive graphics performance (Intel® Iris™ Pro 630)
  • Intel® Optane™ 3D XPoint SSD support
  • Up to 32 GB Dual-Channel DDR4 (2 SO-DIMMs), ECC
  • Up to 24 PCIe Gen. 3 lanes (incl. PCIe x16 PEG port)
  • TQMx86 board controller with flexiCFG options
  • Mobile Intel® 100 series chipset (CM238)
  • Watchdog and thermal management
Rugged Interconnect Technologies TM - TQMx70EB

COM Express: Compact Size Type 6 Module with Intel® Pentium® and Celeron® N3000 Series SoC

  • Dual, quad-core Intel® Pentium® or Celeron® Processor N3000 Series SoC
  • Up to 8 GB Dual Channel DDR3L at 1600MHz
  • Three DDI channels, one LVDS, (shared with DDI3) 3 independent displays (optional eDP support) 
  • Three PCIe x1 (optional ve PCIe x1 with bridge) Gigabit Ethernet
  • Two SATA 6 Gb/s (optional onboard SSD)
  • Four USB 3.0, eight USB 2.0 
  • Smart Embedded Management Agent (SEMA) functions
Rugged Interconnect Technologies TM - COM Express

TQMxE38M: COM Express™ Compact Module (Type 6)

  • Intel® AtomTM E3800 (“Bay Trail-I“)
  • Up to 8 GB DDR3L with ECC support
  • Optimized for ultra low power
  • Extended temperature support
  • Reach featured uEFI BIOS with easy-cong, multi-setup and touch support
  • TQMx86 board controller with exible customization options ( exiCFG) 
  • TPM 1.2 / 2.0
  • iRTC (highly accurate industrial real time clock)
  • '"Green ECO-O ” (minimum of standby power)
  • Watchdog und thermal management
  • Highest reliability, 24/7 certfied
  • Very robust design, formal coating capability
Rugged Interconnect Technologies TM - TQMxE38M

TQMx50UC: COM Express™ Compact Module (Type 6)

  • Intel® Core™ 5000U series („Broadwell-U") with up to 3.2 GHz / 4 MB Cache
  • Up to 16 GB DDR3L on board memory
  • Best Performance-per-Watt ratio (15W TDP)
  • Reach featured uEFI BIOS with easy-config, multi- setup and touch support
  • TQMx86 board controller with flexible customization options (flexiCFG)
  • TPM 1.2 / 2.0
  • iRTC (highly accurate industrial real time clock)
  • "Green ECO-Off" (minimum of standby power)
  • Watchdog und thermal Management
  • Highest reliability, 24/7 certified
  • Rugged design / Conformal coating capability
  • Quality Made-in-Germany
Rugged Interconnect Technologies TM - TQMx50UC

Express-IBER: Extreme Rugged™ COM Express® Type 6 Module with 3rd Generation Intel® Core™ i7 Processor (formerly named Toucan-QM77)

  • 3rd Generation Intel Core i7 Platform
  • 16 GB DDR3 ECC RAM maximum. Supports ruggedized XR-DIMM™ modules
  • Three Digital Display Interfaces, LVDS (dual channel), VGA
  • 1 x Gigabit LAN with AMT 8.0
  • 4 x USB 3.0 / 2.0 host ports, 4 x USB 2.0 host ports
  • 2 x SATA 2.0, 2x SATA 3.0. RAID 0, 1, 5, 10 is supported
  • Trusted Platform Module (TPM)
Rugged Interconnect Technologies TM - Express-IBER

cExpress-HL: COM Express® Compact Size Type 6 Module with 4th Generation Intel® Core™ i7/i5/i3 Processor (Formerly Haswell)

  • 4th Generation Low Power Intel® i7/i5/i3 ULT processor
  • Up to 16 GB DDR3L SDRAM at 1600MHz
  • Two DDI channels, one LVDS supporting 3 independent displays
  • Four PCIe x1 or 1 PCIe x4, Gigabit Ethernet
  • Four SATA 6 Gb/s, two USB 3.0, six USB 2.0
Rugged Interconnect Technologies TM - cExpress-HL

Express-GFC: Compact COM Express® Type 6 Module with AMD Fusion™ G-Series Processor and A50M Controller Hub

  • AMD Fusion™ G-Series Processor
  • AMD A50M Controller Hub
  • Up to 8GB Dual Channel DDR3 SDRAM at 1333MHz
  • Two DDI (Digital Display Interface) for DP/HDMI/DVI/SDVO
  • Six free PCIe x1 lanes (optional PCIe x4)
  • Four SATA 6 Gb/s, Gigabit Ethernet
  • Two USB 3.0/2.0 and six USB 2.0
Rugged Interconnect Technologies TM - Express-GFC

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Express-BASE6: COM Express® Type 6 Reference Carrier Board in ATX Form Factor

  • Seven PCI Express x 1 slots
  • PCI Express x16 / SDVO slot
  • Supports three Digital Display Interfaces (DDI) with HDMI/DVI/DisplayPort output
  • LPC based Super I/O
  • Dual BIOS (SPI and LPC) 
Rugged Interconnect Technologies TM - Express-BASE6

Starter Kit COM Express Type 6: This Type 6 Computer-on-Module Starter Kit gets you going with Carrier Board Design and Software Verification in no time.

  • COM Express Type 6 Module
  • CPU, memory
  • Express-BASE6 Reference Carrier Board
  • Thermal solution (heatspreader and heatsink)
  • Schematics, Design Guide, and User Manuals
  • ADLINK USB stick with Documentation, Drivers, BSPs, Libraries
Rugged Interconnect Technologies TM - Starter Kit COM Express Type 6

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